The new technology of laser cutting, drilling and micromachining of semiconductors used in sensors: – Process without affecting sensor characteristics such as leakage current – The ability to process the sensor on the entire assembly (ROC+Sensor) without damaging neighbouring pixels – The thickness of the machined material from 100, 300 to 500 µm – The possibility of arbitrary sensor shape …
irreplaceable especially for ceramic parts and when highly accuracy requirement is needed
from single holes up to hundreds customized patterns for materials: tungsten carbides, wolframs from diameters of 10µm and bigger
Focused on crucial details Small dimensions in order of tenths of millimeters up to units of micrometers Fine surface roughness < 0,2µm our laser systems enable to reach fine quality surface roughness (<0,2 µm) in combination of very tight tolerance field (+/- 2 µm). Smaller tolerances can be considered after consultation.