Micromachining of semiconductors

The new technology of laser cutting, drilling and micromachining of semiconductors used in sensors: – Process without affecting sensor characteristics such as leakage current – The ability to process the sensor on the entire assembly (ROC+Sensor) without damaging neighbouring pixels – The thickness of the machined material  from 100, 300 to 500 µm – The possibility of arbitrary sensor shape …

customized technology development

for our customer we are offering the whole package of R&D. From design of experiment, through its realization, up to its assessment and reporting. Everything is realized after customer’s agreement.