Micromachining of semiconductors

The new technology of laser cutting, drilling and micromachining of semiconductors used in sensors:

– Process without affecting sensor characteristics such as leakage current

– The ability to process the sensor on the entire assembly (ROC+Sensor) without damaging neighbouring pixels

– The thickness of the machined material  from 100, 300 to 500 µm

– The possibility of arbitrary sensor shape

– Wafer formatting

– Fabrication of microstructures for controlled change of surface properties (adhesion, increasing of active area)