The new technology of laser cutting, drilling and micromachining of semiconductors used in sensors: – Process without affecting sensor characteristics such as leakage current – The ability to process the sensor on the entire assembly (ROC+Sensor) without damaging neighbouring pixels – The thickness of the machined material from 100, 300 to 500 µm – The possibility of arbitrary sensor shape …
developed for monolithic cutting tools, where multi-axis kinematics is applied detailed info will be added soon
according to curtomer’s requiremets depths over 0,5mm up to 5mm with high demand on sufrace roughness
from single holes up to hundreds customized patterns for materials: tungsten carbides, wolframs from diameters of 10µm and bigger
Standard radial micromachining with non-standard results Ablation accuracy for final depth < 1µm
Focused on crucial details Small dimensions in order of tenths of millimeters up to units of micrometers Fine surface roughness < 0,2µm our laser systems enable to reach fine quality surface roughness (<0,2 µm) in combination of very tight tolerance field (+/- 2 µm). Smaller tolerances can be considered after consultation.